-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
December 22, 2023 | Cadence Design SystemsEstimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Wistron, a leading technical service provider (TSP), has adopted and deployed the new AI-driven electromagnetic (EM) in-design analysis workflow, including the Cadence® Optimality™ Intelligent System Explorer and the Cadence Clarity™ 3D Solver, to design a complex 800G network switch. Using the Optimality Explorer’s AI-driven optimization technology and the Clarity 3D Solver for fast, accurate and scalable EM in-design analysis, Wistron was able to analyze large volumes of data—improving overall design reliability while realizing a 2X improvement in turnaround time (TAT).
Legacy 3D solvers typically deliver slower simulation results due to excessive run times and memory usage. In contrast, the Clarity 3D Solver, with its distributed multiprocessing technology and virtually unlimited capacity, quickly analyzes large and complex PCB, IC packaging and complete systems without compromising accuracy. Its exceptional performance is further fueled by the Optimality Explorer, a generative AI-driven, in-design multiphysics system analysis and optimization solution that allows design engineers to explore 3D EM and high-speed signal and power integrity results efficiently and effectively. By revealing design configurations that may not be manually achievable, the Optimality Explorer streamlines design iterations—resulting in shorter and more efficient design cycles.
“By adopting Cadence’s AI-driven optimization solution including Optimality Explorer alongside the Clarity 3D Solver for our 800G network switch and GPU server, we leveraged the design of experiments model to explore multiple simulations quickly and realized far more robust designs with a 2X improvement in TAT,” said Christopher Huang, vice president of the Enterprise and Networking Business Group at Wistron. “With a shift left of AI-enabled multiphysics systems analysis into our electronic design workflow, we are not only improving product performance but gaining valuable design insight and engineering efficiencies.”
“As high-speed electronic systems continue to grow in complexity to meet market demands, Cadence is committed to developing software solutions that address multiphysics challenges and the associated scaling demands,” said Ben Gu, corporate vice president of the Multiphysics System Analysis Group at Cadence. “Wistron has embraced the Cadence multiphysics system analysis portfolio to expedite design throughput and engineering turnaround time. The Clarity and Optimality solutions, coupled with HPC, are the trifecta for next-generation design success.”
The Clarity 3D Solver and the Optimality Explorer support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Magnalytix's Services and Trends in the Electronics Industry
05/10/2024 | Real Time with...IPC APEX EXPOMike Bixenman, president of Magnalytix, explains Magnalytix's services, including third-party validation, test boards, electrical testing, and comprehensive reports. He also discusses emerging trends such as power electronics and reliability. Standards and design improvements also form part of this conversation.
Podcast Review: On the Line with… Designing for Reality
05/09/2024 | Duane Benson, Positive Edge LLCAs a technologist, if I were forced to come up with just one recurring theme that I might call a professional “nemesis,” it would be the difference between theory and reality. A lot of technology we have at our disposal works well in theory but falls short when reality hits. That’s not the only reason I chose to listen to and review On the Line with… Designing for Reality, featuring a series of conversations with ASC Sunstone’s Matt Stevenson, but it certainly helped that the title caught my eye.
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
05/09/2024 | EMA Design AutomationLearn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.